热界面材料

TIM 1– Thermal Gel

缩小的管芯和不断增长的功率需求继续使导热化合物成为IC封装设计的关键部分。为了使散热正常,必须使用硅凝胶,以使封装温度更低,从而提高设备的性能和可靠性。

信越’s thermal gel enables users to reduce the overall cost of their thermal solution.

TIM 2– Thermal Grease

导热硅脂是一种导热的硅酮糊,用作散热器和微处理器之间的介质。由于导热系数高,导热油脂非常适合用作CPU,MPU和GPU的主要导热界面材料(TIM 1和TIM 2)。 G765具有很高的绝缘热阻,而其他化合物的配方强调热导率X23-7762和X23-7783D产品系列的配方强调高整体热导率值和易加工性。

TIM 1.5–两部分可固化间隙填充物

信越’s two-part Gap Fillers are silicone materials with fillers that provide high thermal conductivity while maintaining electrical isolation. The main application for these 热界面材料 is to fill gaps between components and heat sinks. Applied in liquid form, they produce less stress on components during assembly. The material cures in place and remains a soft elastomer.  信越’两部分间隙填充物可用于更大范围的间隙厚度。可以将液体材料以不同的厚度施加在相邻区域中,以解决界面形貌的变化。它们在配合表面之间提供了自然的粘性,但没有建立结构上的粘合连接。

高硬度热界面硅橡胶垫材料

信越 Chemical’s High Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.

As demands for faster electronic devices increase, typically so does the amount of heat generated, requiring the need for higher degree of silicone hardness. If heat cannot escape efficiently, the performance of the device tends to degrade. That is why 信越 Chemical’s thermal interface, high hardness materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.

相变材料(PCM)

信越 Chemical’s thermally conductive phase change thermal pad utilizes phase change material that offers superior cooling solutions for increased thermal management. The PCS series phase change thermal pad is designed to achieve low contact resistance with a thin bond line thickness. 信越 Chemical’s phase change material is consistently utilized in the electronics industry and is considered an important tool in meeting higher performance thermal targets for next generation devices.

This phase change thermal pad, made up of silicone rubber thermal interface materials, contains a high percentage of thermally conductive fillers to dissipate heat, while utilizing an optimal softening temperature. 信越 Chemical’s phase change material exhibits outstanding thermal performance and stability when filling the gap between the heat-generating device and its corresponding heat sink.

护垫&相变材料(PCM)

有机硅基高导热填料

信越 MicroSi Pad Cooling Solutions:

  • 高硬度热界面硅橡胶垫材料
  • 低硬度热界面硅橡胶垫材料
  • 相变材料(PCM)
  • 双面胶带
  • 导电性

 

低硬度热界面硅橡胶垫材料

信越 Chemical’s Low Hardness TC pad series offers a high thermal conductivity and a low thermal resistance solution that outperforms common organic rubbers and plastics.

As demands for faster electronic devices increase, typically so does the amount of heat generated. If heat can not escape efficiently, the performance of the device tends to suffer. That is why 信越 Chemical’s thermal interface materials are consistently utilized in the electronics industry and are considered an important tool in meeting higher performance targets for next generation devices.

双面胶带

信越 Chemical’s TC-SAS thermal conductive tape is a non-acryl based, adhesive, double sided thermal tape that offers superior thermal conductivity, peeling and high adhesion strength properties.

TC-SAS导热胶带的其他优点是出色的电气隔离功能,易于粘贴和返修。

导电性

我们的导电材料系列产品具有优质的硅橡胶质量,并且由于添加了碳和其他导电材料而具有导电性。它们有多种形式,包括片材,胶带,O形圈和其他所需形状。是办公设备和医疗设备的电磁屏蔽的理想选择,以及电气和电子设备的抗静电橡胶的理想选择。

免费的样品

 

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COVID-19声明:
At this time, 信越 MicroSi, Inc. is open and running as normal. We are continuing to monitor the situation 关ly and follow the guidance of public health officials, CDC, WHO, and local and U.S. Governments, to quickly move to take the appropriate precautions. We may adjust our normal operating procedures to support social distancing guidelines. We will continue to keep you informed of any developments.